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发控盒散热设计的热仿真及热测试分析
引用本文:许连虎,杨科.发控盒散热设计的热仿真及热测试分析[J].装备环境工程,2015,12(1):97-101.
作者姓名:许连虎  杨科
作者单位:中国空空导弹研究院,河南洛阳,471099
摘    要:目的对某发射装置发控盒进行散热设计和热分析。方法基于热仿真软件FLOTHERM建立热仿真模型,对该设备进热仿真分析,以得到该设备内部温度分布云图及温升明显元器件的温度值,然后对该设备进行热测试。结果热仿真和热测试结果表明,发控盒内存在发热大、温升较高的元器件,但所有元器件温度均在允许的正常工作温度范围内。结论通过热分析可知,该设备的热设计基本满足要求,并为结构设计的优化提供了依据。

关 键 词:电子元器件  电子设备  热设计  热仿真  热分析
收稿时间:9/3/2014 12:00:00 AM
修稿时间:2015/2/15 0:00:00

Thermal Simulation and Thermal Test Analysis of Heat Radiation Design for Control Box
XU Lian-hu and YANG Ke.Thermal Simulation and Thermal Test Analysis of Heat Radiation Design for Control Box[J].Equipment Environmental Engineering,2015,12(1):97-101.
Authors:XU Lian-hu and YANG Ke
Institution:XU Lian-hu;YANG Ke;AVIC China Airborne Missile Academy;
Abstract:Objective To conduct heat radiation design and thermal analysis for the control box of an emitting device. Methods In order to obtain the temperature contours inside the box and the temperature values of the components with obvious temperature increase, the thermal simulation model of the box was built on the basis of the thermal simulation software FLOTHERM, and then thermal test was carried out for this device. Results Thermal simulation and thermal test results indicated that there were components with high heat radiation and temperature increase inside the emitting control box, but the temperatures of all components were within the allowable normal operating temperature range. Conclusion Thermal analysis indicated that the thermal design of the device basically fulfilled the requirements, which also provides reference for the optimization of structure design.
Keywords:electronic components  electronic equipment  thermal analysis  thermal design  thermal test
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