电子部组件延寿分析

由于军用电子设备的高可靠性以及列装之前的测试无法完全模拟出真实的服役环境,导致测试结果的参考意义不大。鉴于此,文中将以电子部组件的任务剖面作为基础,在制作环境载荷谱时,参考影响电子部组件寿命的关键因素,将电子元器件及焊点疲劳失效的机理模型作为理论依据。在绘制电子部组件的CAD模型时,进行适当简化,使用ANSYS软件对其进行多载荷耦合作用下的有限元仿真,找出电子元器件的薄弱点,并对关键部位进行寿命预测,为军用电子设备故障的初步诊断及装备延寿分析提供借鉴。

Life Extension Analysis of Electronic Component

Due to the high reliability of military electronic equipment and the inability of tests before installation to fully simulate the real service environment, the reference of the test results is not significant. This paper will use the task profile of the electronic component as a basis to refer to the key factors affecting the life of the electronic component when making the environmental load spectrum. The mechanism model of fatigue failure of electronic components and solder joints is used as the theoretical basis. Furthremore, when drawing CAD models of electronic components, it is necessary to make appropriate simplification and use ANSYS software to carry out finite element simulations under multi-load coupling, thereby finding out the weak points of electronic components and predict the life of key parts, which provides reference for the preliminary diagnosis of military electronic equipment failure and equipment life extension analysis.